Verified List of Paper

Conference Image
THE IRES INTERNATIONAL CONFERENCE
Tokyo, Japan 06-03-2017
Electrical Characterization of 3D Stacked TSV With Voids

Pages: 1-4
Author: Shin-Chun Lin, Yu-Jung Huang, Chung-Long Pan

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WRL Cited • 118
Signal Transmission Performance of TSV Stacked Die

Pages: 5-8
Author: Chung-Long Pan, Yan-Bo Lin, Shin-Chun Lin, Yu-Jung Huang

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WRL Cited • 117

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