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Proceeding Details

Title :
ISERD INTERNATIONAL CONFERENCE
Conference Place & Date:
Kuala Lumpur, Malaysia 01-03-2021
ISERD INTERNATIONAL CONFERENCE

Building Impedance Matching Network based on S-Parameter from Manufacturer
Page(s): 23-27  
Author Aizuddin Nuruddin, Tengku Azhar, Zharfan Hamdan, Khairom Nizam Mohamed, Ahmad Redzman  
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WRL Cited By- 5
 
Arrangement of Heatsink for Best Thermal Dissipation and its Impact to the Thermal Performance in High Power Device
Page(s): 28-33  
Author Ahmad Redzman Mohamad Nor, Khairom Nizam Mohamed, Zharfan Hamdan, Tengku Azhar, Aizuddin  
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WRL Cited By- 7
 

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