Proceeding Details
| Title : ISERD INTERNATIONAL CONFERENCE |
| Conference Place & Date: Kuala Lumpur, Malaysia 01-03-2021 |
ISERD INTERNATIONAL CONFERENCE
| Building Impedance Matching Network based on S-Parameter from Manufacturer | |||||||||||
| Page(s): | 23-27 | ||||||||||
| Author | Aizuddin Nuruddin, Tengku Azhar, Zharfan Hamdan, Khairom Nizam Mohamed, Ahmad Redzman | ||||||||||
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| Arrangement of Heatsink for Best Thermal Dissipation and its Impact to the Thermal Performance in High Power Device | |||||||||||
| Page(s): | 28-33 | ||||||||||
| Author | Ahmad Redzman Mohamad Nor, Khairom Nizam Mohamed, Zharfan Hamdan, Tengku Azhar, Aizuddin | ||||||||||
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