Proceeding Details
| Title : THE IRES INTERNATIONAL CONFERENCE |
| Conference Place & Date: Tokyo, Japan 06-03-2017 |
THE IRES INTERNATIONAL CONFERENCE
| Electrical Characterization of 3D Stacked TSV With Voids | |||||||||||
| Page(s): | 1-4 | ||||||||||
| Author | Shin-Chun Lin, Yu-Jung Huang, Chung-Long Pan | ||||||||||
|
|||||||||||
| Signal Transmission Performance of TSV Stacked Die | |||||||||||
| Page(s): | 5-8 | ||||||||||
| Author | Chung-Long Pan, Yan-Bo Lin, Shin-Chun Lin, Yu-Jung Huang | ||||||||||
|
|||||||||||
