Paper Title
Physical And Chemical Peculiarities Of Modifying The Surface Of Aluminium Contact Pads Of Curcuit Chips

Abstract
In this article there is considered the process of chemical coating of aluminium contact pads for high-density mounting of integrated circuits. There has been investigated the chemical deposition on the aluminium and preliminary formed zinc sublayer of tin and nickel coating for soldering. There have been defined the thermodynamic characteristics of zinc sub-layer. Keywords- Aluminium contact pads, chemical deposition, tin, nickel, differential scanning calorimetry.