Paper Title
Investigation and Comparison the Mechanical Behavior of 30SN70PB and SAC305 as Lead and Lead-Free Solder Alloys in Compression Processes

Abstract
Mechanical behavior of each of SAC305 and 30Sn70Pb as lead-free and lead-based solder alloys was investigated and compared; more than 60spherical balls samples were compressed to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and properties. The results showed significant elastic and plastic anisotropy of tin phase in lead- free alloys and micro structural changes and stability under isothermal aging processes. Keywords- Tin Anisotropy Behavior, Lead-Free Solder, And Composite Solder.