Paper Title
Growth Mechanisms of CuNi on Ni Surface using Molecular Dynamics Simulations

Abstract
Molecular dynamics (MD) simulation is used to simulate the deposition process of Cu and Ni atoms on the Ni(001) substrate with anincident angle of 0°,an incident energy of 0.3 eV, a substrate temperature of 300 K, and the different compositionsare Cu¬20Ni80; Cu¬40Ni60; Cu¬50Ni50; Cu¬80Ni20. The results indicate that the surface roughness of the CuNi film increaseslightly as increasing the contents of Cu atoms. In the deposition process, the intermixing occurs at the interface between the CuNi film and the Ni substrate. In addition, the intermixing between Cu-Ni atoms and Ni substrate decrease as increasing the contents of Cu atoms. The peak-to-peak distances of g(r) clearly indicate that the crystal structure of CuNi film is FCC structure. Keywords - Molecular dynamics; Surface roughness; Interface; Deposition; Composition.